| Product Name: Solder Paste Thickness Tester |
| Product model: 3D SPI 6500 |
| Type: Semi-automatic 3D mode |
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| First, product features |
| 1. Friendly programming interface. |
| 2, a variety of measurement methods |
| 3, adjustable scanning spacing |
| 4, the image of the 3D simulation function |
| 5, independent 3D dynamic observer |
| 6, powerful SPC function |
| 7, one button back to the screen center function |
| 8, can measure silk screen and copper thickness |
| |
| Second, product features |
| 1. The original German imported high-definition color camera is used to ensure the high precision and high stability of the test. |
| 2. The military-grade secondary laser is used, which is less interfered by the external environment light source and has a longer stable life. |
| 3. With flexible hardware design, light source, laser and camera, it can test different color PCB boards. |
| 4. The software analysis conditions are based on the database, and the early warning function is realized according to the analysis conditions, which is intuitive and easy to understand. |
| 5. Powerful report analysis function, automatically generate R-Chart, X-Bar, automatically calculate CPK. |
| 6. Export detailed and complete SPC reports, completely avoiding the various drawbacks of handwritten reports. |
| 7. The software adopts a simple and practical concept, focusing on the high-precision design of the test, and the correction block repeatability is up to plus or minus 0.001mm. |
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| Third, the product parameters |
| 1. Brand: American ASC |
| 2. Model: SPI-6500 |
| 3. Software Language: Simplified Chinese, English |
| 4. Applications: solder paste, red plastic, BGA, FPC, CSP, etc. |
| 5. Measurement items: thickness, area, volume, plane distance |
| 6. PCB deformation correction: PCB tilt angle is automatically calculated, automatically corrected |
| 7. Focus mode: manual focus |
| 8. Lighting source: white LED module |
| 9. Measuring light source: 650nm low power red laser module |
| 10. Measurement principle: laser 3 angular function method measurement |
| 11. Y-axis automatic movement range: 60 mm |
| 12. Precision resolution: 0.1 micron |
| 13. Field of view (FOV): 15*12 (W*H) mm |
| 14. Scanning step: minimum 5 microns (5 microns / 10 microns / 15 microns / 20 microns) |
| 15. PCB size: 400*400 mm (special size can be customized) |
| 16. Repeated measurement accuracy: less than 1 micron |
| 17. Volume repeatability: less than 1% |
| 18. Area repeatability: less than 1% |
| 19. Allow PCB thickness: 1~10 mm |
| 20. Maximum measured height: 4 mm |
| 21. Image resolution: 3 million |
| 22. Measurement speed: up to 250 frames / sec |
| 23. 3D display mode: point array display, line array display, rendering display, can be rotated at any angle |
| 24. Measurement method: automatic full-screen measurement, frame selection for automatic measurement, frame selection for manual measurement |
| 25. SPC analysis: average, maximum, minimum, X-Bar&R graph analysis, histogram analysis & Ca/Cp/Cpk output. Sigma automatically judges |
| 26. Process control: production line, time, printed materials, solder paste data, steel mesh data, |
| 27. Operating System: Windows 7 or above |
| 28. Computer system: dual-core 2G or above, 2G memory, PCI slot, 3 USB ports, 20-inch LCD monitor |
| 29. Equipment power supply: 220V/50/60HZ |
| 30. Device power consumption: 300W |
| 31. Equipment weight: 45 kg |
